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matthews3
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- matthews3 parentJava Applets were my introduction to programming! I'm sad to see them go.
- 2 points
- At the silicon level, it is the same.
Each memory DIMM/stick is made up of multiple DRAM chip. ECC DIMMs have an extra chip for storing the error correcting parity data.
The bottleneck is with the chips and not the DIMMs. Chip fabs are expensive and time consuming, while making PCBs and placing components down onto them is much easier to get into.
- A 300mm wafer on a recent process node (TSMC N3) is estimated to be around $20k at quantity[1]. I don't know what kind of testing and crazy packaging processes would cost for a wafer-scale chip, but I can't imagine it would put the price anywhere near the millions.
[1]: https://www.tomshardware.com/tech-industry/tsmcs-wafer-prici...
- > Seems like I loaded the film incorrectly and nothing was on them, so I hate my life right now. Let’s skip this part then.
That's a shame! It's a mistake almost everyone that has used a film camera has made, though.
On these older SLRs, one thing you can do to check that the film is loaded properly is to watch the rewind crank as you advance to the next frame. If everything is loaded and the film is engaged properly, you should see it turn.