synack parent
Last I checked, a lot of the US manufactured dies got shipped overseas for packaging. I wonder when they'll have that capability domestically.
Yes.
CHIPS invested heavily in OSAT and Packaging capacity - especially in TX. Samsung, Micron, OmSemi, and TI took full advantage of that under the Biden admin while Intel and TSMC were fighting on the airwaves to undermine each other.
Much of the rest has been reinvested in SK and India (TI is part of the SCL Mohali modernization RFP) as part of the QUAD+ initiative.
A lot of us in the private and public sector working in this space aren't idiots.